COF (Chip on Flex) is a display packaging technology, where a chip is mounted directly to a flex circuit. Also refer to COG and COP.
Driver IC Packaging & Assembly for Flexible Displays
Global Chip On Flex COF Market Size was estimated at USD 1716.19 million in 2021 and is projected to reach USD 2349.61 million by 2028, by Organicmarket Research Business Consulting
COF technology, short for chip on film, is widely used in small and medium-sized displays.
Circuitos Integrados COF Fornecedores e Fábrica - Preço de Produtos Personalizados - Tecnologia Rina
COF LCD and TAB Module Manufacturer - Palmtech
COF (Chip On Film) Package supplier and manuf
Schematics of the COF bonding process using ACFs.
Difference Between iPhone LCD Assembly
COF technology, short for chip on film, is widely used in small and medium-sized displays.
China Top Selling Cof/Tab Bonding Machine Cly-818sh for 100 Inch Flat Panel Repairing - China Hot Press Equipment, LCD Repair Machine
What is the difference between COF, COG in Mobile LCD Screen? - News - SCRC TECH CO., LTD
About COF, Technology introduction
