Determining Thermal Conductivity and Coefficient of Thermal Expansion (CTE) of Epoxy Mold Compounds

Key material characteristics of epoxy mold compound (EMC) A and B

Enhancing predictability of thermal warpage by applying temperature-dependent Poisson's ratio of epoxy molding compound - ScienceDirect

Thermally Conductive Epoxy Adhesives

Advances in Epoxy Molding Compounds - Dexter Technical Paper (1992)

High Temperature Thermosets With a Low Coefficient of Thermal Expansion - Wippl - 2005 - Macromolecular Materials and Engineering - Wiley Online Library

Will An Adhesion Promoter Prevent Delamination?

Improving the thermal conductivity of epoxy composites using a combustion-synthesized aggregated β-Si3N4 filler with randomly oriented grains

Designing Poly(vinylidene fluoride)-Silicon Carbide Nanowire Composite Structures to Achieve High Thermal Conductivity

Thermal Behavior of Thermoset Molding Compounds Used to Encapsulate IC Devices

Semiconductor Epoxy Mold Compounds Archives

What is the thermal expansion rate of graphite? - Quora

Enhancing Thermal Conductivity of hBN/SiC/PTFE Composites with Low Dielectric Properties via Pulse Vibration Molding - Feng - 2023 - Macromolecular Rapid Communications - Wiley Online Library

Chris Perabo, Author at CAPLINQ BLOG

List of Henkel Epoxy Coating Powders and Molding Compounds sold to SolEpoxy

Thermal conductivities of the three investigated EMC with different